CPU |
- 14th/13th/12th gen Intel® Core™ processor, up to 65W
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Chipset |
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System Memory |
- 2 x 262-pin DDR5 5600/4800/4000 non-ECC SO-DIMM, up to 96GB
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BIOS |
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COM |
- 1 x RS-232/422/485 (default RS-232)
- More COM ports available from extension I/O modules
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USB |
- Intel® H610E:
- 2 x USB 3.2 Gen2x1 (10G) type A
- 2 x USB 3.2 Gen1x1 (5G) type A
- 2 x USB 2.0
- 2 x USB 2.0 Type A
- Intel® Q670E:
- 6 x USB 3.2 Gen2x1 (10G) type A
- 1 x USB 2.0 (Internal, up to 30mm) 180D type A
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Ethernet |
- 1 x 2.5GbE LAN (Intel® I226-V)
- 1 x 1GbE LAN (Intel® 1219-LM); with Intel AMT (Q670)
- More LAN ports available from extension I/O modules
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Display |
- 1 x DisplayPort++ with 4096 x 2160 resolution supported
- 1 x HDMI with 4096 x 2160 resolution supported
- 1 x DVI-D with 1920 x 1200 resolution supported
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Digital I/O |
- Available from extension I/O modules
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Audio |
- 1 x 3.5mm jack for Mic-in and Line-out
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Storage |
- Intel® H610E:
- 2 x 2.5" HDD/SSD bay (7/9.5/15 mm height)
- Intel® Q670E:
- 2 x 2.5" HDD/SSD bay (7/9.5/15 mm height)
- 1 x M.2 Key M 2280 socket (PCIe x4 Gen4)
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Expansion |
- 1 x Full-size PCI Express Mini Card slot (USB & PCIe interface) with SIM slot
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Others |
- TPM 2.0
- 1 x HDD/SSD access LED
- 3 x User's LED
- 1 x Switch for power on/off with LED (default ATX)
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Power |
- Input: 18 to 36 VDC
- 1 x Switch for power on/off with LED (default ATX)
- 1 x 4-pin terminal block (5.08 mm) for DC input
- 1 x 4-pin terminal block (5.08 mm) for ignition control, remote power and remote LED
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Construction |
- Aluminum extrusion heavy-duty cold-rolled steel
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Operating Temperature |
- -20°C to +60°C with 13th/12th gen Intel® Core™ processor and industrial wide-temp SSD, 0.7m/s air flow
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Relative Humidity |
- 10% to 90%, non-condensing
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Dimensions (W x H x D) |
- 83.5 x 192 x 260 mm (3.29" x 3.62" x 10.24")
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Weight (net/gross) |
- 4.2 kg (9.26 lb)/5.2 kg (11.46 lb)
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EOS Support |
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Software Support |
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Certifications |
- CE (EN 61000-6-4/EN 61000-6-2)/FCC
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